US Patent Issued to Infineon Technologies Austria on Sept. 23 for "Semiconductor package including a chip-substrate composite semiconductor device" (Austrian Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,501, issued on Sept. 23, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Semiconductor package including a chip-substrate composite semiconductor device" was invented by Christian Fachmann (Villach, Austria), Barbara Angela Glanzer (Klagenfurt am Worthersee, Austria) and Andreas Riegler (Wernberg, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high voltage semiconductor package includes a semiconductor device. The semiconductor device includes a high voltage semiconductor transistor chip having a front side and a backside. A low voltage load electrode and a control electrode are disposed on the front side of the semi...