ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,068, issued on Oct. 7, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Stacked module arrangement" was invented by Peter Luniewski (Poing, Germany), Ivan Nikitin (Regensburg, Germany) and Bernd Schmoelzer (Radenthein, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A stacked module arrangement includes: a first molded electronic module; a second molded electronic module; and an interface by which the first molded electronic module and the second molded electronic module are physically and electrically connected to one another in a stacked configuration. The first molded electronic module is a power electronic module havin...