US Patent Issued to Infineon Technologies Austria on Oct. 7 for "Electronic module including a semiconductor package disposed on an interposer layer" (German, Austrian Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,063, issued on Oct. 7, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Electronic module including a semiconductor package disposed on an interposer layer" was invented by Edward Fuergut (Dasing, Germany), Davide Chiola (Villach St. Georgen, Austria), Martin Gruber (Schwandorf, Germany) and Wolfram Hable (Neumarkt, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic module includes a semiconductor package including a die carrier, a semiconductor transistor die disposed on the die carrier, an electrical conductor connected to the semiconductor die, and an encapsulant covering the die carrier, the semiconductor di...