ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,173, issued on Nov. 4, was assigned to Infineon Technologies Austria AG (Villach, Austria).
"Multi-chip device with gate redistribution structure" was invented by Ralf Otremba (Kaufbeuren, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power device package includes first and second power transistor chips each having a control electrode, a first load electrode and a second load electrode. A control package terminal is electrically coupled to the control electrode of the first power transistor chip via a first wire bond connection and to the control electrode of the second power transistor chip via a second wire bond connection. A first packa...