US Patent Issued to Infineon Technologies Austria on Nov. 4 for "Method for fabricating a semiconductor device including an embedded semiconductor die" (German, Austrian Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,116, issued on Nov. 4, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Method for fabricating a semiconductor device including an embedded semiconductor die" was invented by Edward Fuergut (Dasing, Germany), Achim Althaus (Regensburg, Germany), Martin Gruber (Schwandorf, Germany), Marco Nicolas Mueller (Villach, Austria), Bernd Schmoelzer (Radenthein, Austria), Wolfgang Scholz (Olching, Germany) and Mark Thomas (Bodensdorf, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a semiconductor device includes: providing a die carrier; disposing a semiconductor die on a main face of the die carrier, the s...