US Patent Issued to Infineon Technologies Austria on Nov. 25 for "Package for a lateral power transistor" (German Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,730, issued on Nov. 25, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Package for a lateral power transistor" was invented by Stefan Wotzel (Erfurt, Germany) and Marcus Bohm (Mintraching, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A transistor package includes a semiconductor transistor chip having opposite first and second surfaces, one or a plurality of first load electrodes, one or a plurality of second load electrodes, and a control electrode on the first surface. A leadframe faces the first surface of the semiconductor transistor chip and includes a first terminal, a second terminal, and a control terminal of...