ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,144, issued on March 25, was assigned to Infineon Technologies Austria AG (Villach, Austria).
"Semiconductor device and method for fabricating a semiconductor device" was invented by Alexander Heinrich (Bad Abbach, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a semiconductor device includes providing a die with a metallization layer including a first metal with a high melting point; providing a die carrier including a second metal with a high melting point; providing a solder material including a third metal with a low melting point; providing a layer of a fourth metal with a high melting point on the semiconducto...