US Patent Issued to Infineon Technologies Austria on March 18 for "Semiconductor device, semiconductor component and method of fabricating a semiconductor device" (Austrian Inventor)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,162, issued on March 18, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Semiconductor device, semiconductor component and method of fabricating a semiconductor device" was invented by Carsten von Koblinski (Villach, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a semiconductor device includes a semiconductor body having a first major surface, a second major surface opposing the first major surface and at least one transistor device structure, a source pad and a gate pad arranged on the first major surface, a drain pad and at least one further contact pad coupled to a further device structure. The dr...