US Patent Issued to Infineon Technologies Austria on Jan. 28 for "Semiconductor package and lead frame with enhanced device isolation" (Singaporean Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,211,770, issued on Jan. 28, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Semiconductor package and lead frame with enhanced device isolation" was invented by Balehithlu Manjappaiah Upendra (Singapore) and Kok Kiat Koo (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor die, a first group of leads that each comprise an interior end, and an encapsulant body of electrically insulating material that encapsulates the semiconductor die and the interior ends of the leads from the first group, wherein a gap is disposed between outer sidewalls of two immediately adjacent ones o...