US Patent Issued to Infineon Technologies Austria on Jan. 13 for "Method of manufacturing semiconductor chips having a side wall sealing" (Austrian Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,499, issued on Jan. 13, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Method of manufacturing semiconductor chips having a side wall sealing" was invented by Christian Fachmann (Furnitz, Austria) and Ingo Muri (Villach, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing semiconductor chips having a side wall sealing is described. The method includes forming dicing trenches in a semiconductor wafer. The side walls of the dicing trenches are anodized to generate an anodic oxide layer at the side walls of the dicing trenches. Semiconductor chips are separated from the semiconductor wafer."

The pate...