US Patent Issued to Infineon Technologies Austria on Feb. 18 for "Dipped coated electronic module assembly with enhanced thermal distribution" (Malaysian Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,232,302, issued on Feb. 18, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Dipped coated electronic module assembly with enhanced thermal distribution" was invented by Chee Yang Ng (Muar, Malaysia) and Swee Kah Lee (Melaka, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing an electronic module assembly includes forming the electronic module assembly, wherein the electronic module assembly comprises a plurality of internal exposed surfaces, a plurality of external exposed surfaces, at least one internal cavity, and an internal heat source configured to generate heat internally within the electronic m...