US Patent Issued to Infineon Technologies Austria on Dec. 23 for "Semiconductor package comprising a cavity with exposed contacts and a semiconductor module" (German, Austrian Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,051, issued on Dec. 23, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Semiconductor package comprising a cavity with exposed contacts and a semiconductor module" was invented by Julian Treu (Munich), Ivan Nikitin (Regensburg, Germany) and Bernd Schmoelzer (Radenthein, Austria).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package comprising a substrate, at least one semiconductor die disposed on the substrate, at least one electrical connector connected with the semiconductor die, an encapsulant covering the substrate, the at least one semiconductor die, and at least partially the electrical connector, the enc...