US Patent Issued to Infineon Technologies Austria on Dec. 2 for "Semiconductor package with balanced impedance" (German Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,040, issued on Dec. 2, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Semiconductor package with balanced impedance" was invented by Peter Luniewski (Poing, Germany), Markus Neubert (Munich), Michael Fuegl (Neumarkt, Germany), Waldemar Jakobi (Soest, Germany), Michael Leipenat (Pommelsbrunn, Germany) and Egbert Lamminger (Soest, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate including a die pad, first and second discrete transistor dies mounted on the die pad, an encapsulant body that encapsulates the first and second discrete transistor dies, and a plurality of leads that ar...