US Patent Issued to Infineon Technologies Austria on April 22 for "Semiconductor module with bond wire loop exposed from a molded body and method for fabricating the same" (German Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,563, issued on April 22, was assigned to Infineon Technologies Austria AG (Villach, Austria).

"Semiconductor module with bond wire loop exposed from a molded body and method for fabricating the same" was invented by Ivan Nikitin (Regensburg, Germany) and Peter Luniewski (Poing, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module includes a substrate, a semiconductor die arranged on the substrate, at least one first bond wire loop, wherein both ends of the at least one first bond wire loop are arranged on and coupled to a first electrode of the semiconductor die, and a molded body encapsulating the semiconductor die, wherein ...