US Patent Issued to Industry-Academic Cooperation Foundation, Dankook University on Aug. 12 for "Nanogap structure and method of manufacturing nanogap structure through undercut" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,389,810, issued on Aug. 12, was assigned to Industry-Academic Cooperation Foundation, Dankook University (Gyeonggi-do, South Korea).

"Nanogap structure and method of manufacturing nanogap structure through undercut" was invented by Seung-Ki Lee (Seoul, South Korea), Jae-Hyoung Park (Gyeonggi-do, South Korea), Hyeong-Min Kim (Gyeonggi-do, South Korea), Young-Ho Nam (Gyeonggi-do, South Korea) and NaKyung Lee (Gyeonggi-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a nanogap structure and a method of manufacturing the nanogap structure through undercut. The method includes forming a nanosized gap between primary metal and seco...