ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,150, issued on Sept. 23, was assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu, Taiwan).
"Power module" was invented by Wen-Chih Chen (Zhubei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power module includes a power circuit board, a signal pin, a shielding substrate, and an electrically insulating component. The signal pin is disposed and stands on the power circuit board. The shielding substrate is located above the power circuit board and spaced apart from the power circuit board. The shielding substrate has a first through hole. The signal pin is disposed through the first through hole. The electrically insulating compon...