ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,419,118, issued on Sept. 16, was assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu, Taiwan).
"Cell module" was invented by Chiou-Chu Lai (Zhubei, Taiwan), Chun-Wei Su (Zhubei, Taiwan), Yi-Chun Liu (Zhudong Township, Taiwan), Hsin-Hsin Hsieh (Taipei, Taiwan), Hsin-Chung Wu (Sihu Township, Taiwan), En-Yu Pan (Zhubei, Taiwan) and Chin-Ping Huang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin laye...