US Patent Issued to Industrial Technology Research Institute on Oct. 28 for "Package structure, antenna module and probe card" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,668, issued on Oct. 28, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan).

"Package structure, antenna module and probe card" was invented by Chieh-Wei Feng (Taoyuan, Taiwan), Tai-Jui Wang (Kaohsiung, Taiwan), Jui-Wen Yang (New Taipei, Taiwan) and Tzu-Yang Ting (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a package structure, an antenna module, and a probe card. The package structure includes a connection member and a first redistribution structure disposed on the connection member. The connection member includes a conductive connector and an insulation layer surrounding the ...