US Patent Issued to Industrial Technology Research Institute on Oct. 21 for "Power module and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,403, issued on Oct. 21, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan).

"Power module and manufacturing method thereof" was invented by Hsin-Han Lin (Hsinchu County, Taiwan) and Tai-Jyun Yu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a power module and a manufacturing method thereof. The power module includes an insulating substrate, a first, a second and a third conductive layers, a first thermal interface material layer, a first and a second chips and a thermal conductive layer. The insulating substrate has a first and a second surfaces opposite to each other. The first and the second co...