US Patent Issued to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE on July 29 for "Antenna-in-package construction with frequency division duplex technology" (Taiwanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,794, issued on July 29, was assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu, Taiwan).

"Antenna-in-package construction with frequency division duplex technology" was invented by Ching-Wen Chiang (Hsinchu, Taiwan), Huan-Ta Chen (Baoshan Township, Taiwan), Chung-Lien Ho (Zhubei, Taiwan) and Chin Pin Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An antenna-in-package construction includes a chip layer, a second dielectric layer, and a first dielectric layer stacked in order. The first dielectric layer has a dielectric constant more than 3.5. The antenna-in-package construction includes a transmitting antenna array, ...