ALEXANDRIA, Va., July 23 -- United States Patent no. 12,365,758, issued on July 22, was assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu, Taiwan).
"Encapsulation structure" was invented by Cheng-Yi Lin (Hukou Township, Taiwan) and Shih-Ming Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin composition is provided, which includes a first polymer and a second polymer. The first polymer is formed by a reaction of an epoxy resin modified with a first elastic molecular segment and an epoxy resin curing agent. The second polymer is formed by a polymerization of an acrylate modified with a second elastic molecular segment."
The patent was filed on June 28, 2021, under Applic...