US Patent Issued to Industrial Technology Research Institute on Aug. 26 for "Antenna-in-package with heat dissipation structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,401,109, issued on Aug. 26, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan).

"Antenna-in-package with heat dissipation structure" was invented by Heng-Chieh Chien (New Taipei, Taiwan), Shu-Jung Yang (New Taipei, Taiwan), Feng-Hsiang Lo (Hsinchu County, Taiwan) and Yu-Lin Chao (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An antenna-in-package with a heat dissipation structure includes a circuit board, an antenna substrate, a chip, a plurality of heat dissipation fins, a chassis, and dielectric fluid. The circuit board has a first surface and a second surface opposite to the first surface. The antenna substrat...