ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,402, issued on Oct. 21, was assigned to INDIUM Corp. (Utica, N.Y.).
"Liquid metal thermal interface" was invented by Ross B. Berntson (New Hartford, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Liquid metal thermal interface materials and their uses in electronics assembly are described. In one implementation, a semiconductor assembly includes: a semiconductor die; a heat exchanger; and a thermal interface material (TIM) alloy bonding the semiconductor die to the heat exchanger without using a separate metallization layer on a surface of the semiconductor die or a surface of the heat exchanger. The TIM alloy may be formed by placing a TIM mat...