ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,567, issued on May 13, was assigned to INDIUM Corp. (Utica, N.Y.).
"Solid metal foam thermal interface material" was invented by Ross B. Berntson (New Hartford, N.Y.) and David P. Socha (Whitesboro, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Solid metal foam thermal interface materials and their uses in electronics assembly are described. In one implementation, a method includes: applying a thermal interface material (TIM) between a first device and a second device to form an assembly having a first surface of the TIM in in touching relation with a surface of the first device, and a second surface of the TIM opposite the first surface in to...