US Patent Issued to INDIAN INSTITUTE OF TECHNOLOGY BOMBAY on June 10 for "Method and apparatus for fabricating high aspect ratio structures" (Indian Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,325,847, issued on June 10, was assigned to INDIAN INSTITUTE OF TECHNOLOGY BOMBAY (Mumbai, India).

"Method and apparatus for fabricating high aspect ratio structures" was invented by Prasanna Subhash Gandhi (Mumbai, India), Makrand Ashok Rakshe (Satara, India) and Tanveer ul Islam (Banihal, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments herein disclose a method for fabricating high aspect ratio structures. The method includes depositing a predefined quantity of a viscoelastic fluid on a top surface of a bottom cell plate and compressing the viscoelastic fluid deposited on the top surface of the bottom cell plate using a bottom surface ...