US Patent Issued to Inari Technology Sdn Bhd on Sept. 16 for "System, process and a jig for forming conformal EMI shield on package-level electronics or a portion thereof" (Malaysian Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,976, issued on Sept. 16, was assigned to Inari Technology Sdn Bhd (Bayan Lepas, Malaysia).

"System, process and a jig for forming conformal EMI shield on package-level electronics or a portion thereof" was invented by Boon Siew Ng (Sungai Petani, Malaysia), Soon Kiang Tan (Bayan Lepas, Malaysia) and Eng Soon Loh (Ayer Itam, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system for forming a conformal electromagnetic interference shield on at least one singulated electronic package (300), including a tray preparation module that prepares a tray (200) by mounting an electromagnetic interference tape (202) onto a frame (201), with the elect...