US Patent Issued to IMEC VZW on Sept. 30 for "Superconductive interconnect structure" (Belgian Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,389, issued on Sept. 30, was assigned to IMEC VZW (Leuven, Belgium).

"Superconductive interconnect structure" was invented by Anna Yurievna Herr (Leuven, Belgium), Quentin Paul Herr (Leuven, Belgium), Zsolt Tokei (Leuven, Belgium) and Anshul Gupta (Leuven, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for forming a superconducting interconnect structure, comprising: providing a substrate, forming a superconductive layer, forming a layer of a first dielectric material, removing parts of the layer of the first dielectric material and of the superconductive layer so as to form a pattern comprising a first set of line structures compr...