US Patent Issued to Imec vzw on Oct. 28 for "Method for producing an interconnect via" (Belgian Inventor)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,675, issued on Oct. 28, was assigned to Imec vzw (Leuven, Belgium).

"Method for producing an interconnect via" was invented by Pieter Weckx (Bunsbeek, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes: producing on a substrate a stack of: a first layer including a first dielectric material, a second layer including dielectric material on the first layer, and an etch stop layer between the first layer and the second layer, etching a trench through the second layer, the etch stop layer, and the first layer, producing a lower conductive line in the trench, producing a third layer including a second dielectric material in the tren...