US Patent Issued to IMEC VZW on May 27 for "Superconducting chip package with improved magnetic shielding" (Belgian Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,756, issued on May 27, was assigned to IMEC VZW (Leuven, Belgium).

"Superconducting chip package with improved magnetic shielding" was invented by Vadiraj Manjunath Ananthapadmanabha Rao (Leuven, Belgium), Steven Van Winckel (Tielt-Winge, Belgium) and Steven Brebels (Heverlee, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package includes a metal plate and a carrier substrate mounted on the top surface thereof, which includes one or more superconducting chips mounted on the carrier substrate or configured to receive the one or more chips mounted thereon. The carrier substrate and the plate are sandwiched between the planar portions of a f...