ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,675, issued on July 29, was assigned to IMEC VZW (Leuven, Belgium).
"Method of producing hybrid semiconductor wafer" was invented by Gauri Karve (Tervuren, Belgium), Yunlong Li (Heverlee, Belgium), Luc Haspeslagh (Lubbeek, Belgium), Philippe Soussan (Wavre, Belgium) and Deniz Sabuncuoglu Tezcan (Herent, Belgium).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to a preferred embodiment of the method of the invention, an assembly is produced comprising a temporary wafer and one or more tiles that are removably attached to the temporary wafer, preferably through a temporary adhesive layer. The tiles comprise a carrier portion and an active mate...