US Patent Issued to IMEC VZW on Jan. 27 for "Method for producing a buried interconnect rail of an integrated circuit chip" (Belgian Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,779, issued on Jan. 27, was assigned to IMEC VZW (Leuven, Belgium).

"Method for producing a buried interconnect rail of an integrated circuit chip" was invented by Zheng Tao (Heverlee, Belgium) and Waikin Li (Leuven, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes forming a trench in a semiconductor layer of a device wafer and depositing a liner on the trench sidewalls. The liner is removed from the trench bottom, and the trench is deepened anisotropically to form an extension fully along the trench, or locally by applying a mask. The semiconductor material is removed outwardly from the extension by etching to create a cavit...