US Patent Issued to IMEC VZW on Dec. 9 for "Interconnect structure of a semiconductor component and methods for producing the structure" (Belgian, American Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,424, issued on Dec. 9, was assigned to IMEC VZW (Leuven, Belgium).

"Interconnect structure of a semiconductor component and methods for producing the structure" was invented by Gaspard Hiblot (Leuven, Belgium), Douglas Charles La Tulipe (Cambridge, Mass.) and Anne Jourdain (Grez-Doiceau, Belgium).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method producing a nano-sized interconnect structure that electrically connects the front side of a semiconductor substrate to the back side of the substrate is provided. In one aspect, the method produces a semiconductor component such as an integrated circuit chip that includes active devices formed on the fr...