ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,392, issued on July 29, was assigned to IMEC VZW (Leuven, Belgium) and Katholieke Universiteit Leuven (Leuven, Belgium).
"3D integrated circuit" was invented by Francky Catthoor (Temse, Belgium) and Dawit Burusie Abdi (Leuven, Belgium).
According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosed 3D IC includes a plurality of vertically stacked device tiers, each device tier comprising an SRAM circuit, each SRAM circuit comprising an SRAM bit cell, wherein the bit cells are stacked on top of each other to define a stack of bit cells and wherein and each bit cell comprises first and second pass transistors, first pull-up and pull-down transistors, and ...