ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,853, issued on Jan. 20, was assigned to II-VI DELAWARE INC. (Wilmington, Del.).

"Photonic optoelectronic module packaging" was invented by Gilles P. Denoyer (San Jose, Calif.), Daniel Mahgerefteh (Los Angeles), Vipul Bhatt (Sunnyvale, Calif.), Shiyun Lin (San Diego) and Brian Kim (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one example, an optoelectronic module may include a stack assembly including an electrical integrated circuit and an optical integrated circuit electrically and mechanically coupled to one another, an interposer electrically and mechanically coupled to the stack assembly, and an optical connector to optica...