ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,770, issued on Aug. 19, was assigned to IHP GmbH-Innovations for High Performance Microelectronics/Leibniz-Instit. fur innovativeIHP GmbH-Innovations for High Performance Microelectronics/Leibniz-Instit. fur innovative (Frankfurt, Germany) and TECHNISCHE UNIVERSITAT BERLIN (Berlin).
"Semiconductor device with back side protection mechanism" was invented by Norbert Herfurth (Frankfurt, Germany), Marco Lisker (Frankfurt, Germany), Elham Amini (Berlin), Christian Boit (Berlin) and Jean-Pierre Seifert (Werder, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device, a method of operating the semiconductor device, and a method of fa...