US Patent Issued to IHI on Sept. 23 for "Thickness measurement device and thickness measurement method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,254, issued on Sept. 23, was assigned to IHI Corp. (Tokyo).

"Thickness measurement device and thickness measurement method" was invented by Seiichi Ohmori (Tokyo), Masahiro Hato (Tokyo) and Tomohiko Shiota (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a thickness measurement device, including: an ultrasonic transmitter configured to transmit ultrasonic waves to a measurement object; an ultrasonic receiver configured to receive the ultrasonic waves reflected by the measurement object; a first extraction unit configured to extract a first reflected wave reflected by a first surface in the measurement object; a second extraction un...