US Patent Issued to IHI on March 18 for "Heat exchange structure" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,253,316, issued on March 18, was assigned to IHI Corp. (Tokyo).

"Heat exchange structure" was invented by Hiroyuki Kamata (Tokyo), Shigeki Sakakura (Tokyo), Nobuyuki Honma (Tokyo), Akihisa Yano (Tokyo), Taiga Yamamoto (Tokyo), Yusuke Takeuchi (Tokyo), Takuya Yoshinoya (Tokyo), Takuya Hashimoto (Tokyo) and Daisuke Tsunoda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat exchange structure includes: two flow channels stacked in a stacking direction (Y direction) and thermally coupled to each other; and a fin structure detachably installed in at least one flow channel of the two flow channels. The fin structure includes fins arranged in a long...