US Patent Issued to IDEMITSU KOSAN on Feb. 10 for "Thermosetting composition for injection molding, method for producing molded article using the same, and cured product" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,961, issued on Feb. 10, was assigned to IDEMITSU KOSAN Co. LTD. (Tokyo).

"Thermosetting composition for injection molding, method for producing molded article using the same, and cured product" was invented by Yutaka Obata (Tokyo), Yasunari Okada (Tokyo), Katsuki Ito (Tokyo) and Kazuki Watanabe (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A thermosetting composition for injection molding comprising: (A) a compound represented by the following formula (A2) or (A3), and (B) a thermal polymerization initiator; wherein the composition further comprises no (G) titanium oxide or comprises (G) titanium oxide, when the composition comprises the com...