US Patent Issued to ICP TECHNOLOGY, Sentec Green Energy Technology on Nov. 4 for "Flip-chip packaged power transistor module having built-in gate driver" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,463,188, issued on Nov. 4, was assigned to ICP TECHNOLOGY Co. LTD. (Taoyuan, Taiwan) and Sentec Green Energy Technology Co. Ltd. (Taoyuan, Taiwan).

"Flip-chip packaged power transistor module having built-in gate driver" was invented by Ho-Chieh Yu (Taoyuan, Taiwan), Chen-Cheng-Lung Liao (Taoyuan, Taiwan), Chun-Yu Lin (Taoyuan, Taiwan), Jason An Cheng Huang (Taoyuan, Taiwan), Chih-Chuan Liang (Taoyuan, Taiwan), Kun-Tzu Chen (Taoyuan, Taiwan) and Nai-His Hu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a flip-chip packaged power transistor module having a built-in gate driver, for outputting a high-power signal of at least t...