US Patent Issued to iCometrue on June 10 for "Vertical interconnect elevator based on through silicon vias" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,790, issued on June 10, was assigned to iCometrue Co. Ltd. (Hsinchu County, Taiwan).

"Vertical interconnect elevator based on through silicon vias" was invented by Jin-Yuan Lee (Miaoli County, Taiwan) and Mou-Shiung Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package includes a first integrated-circuit (IC) chip; a second integrated-circuit (IC) chip over the first integrated-circuit (IC) chip; a connector over the first integrated-circuit (IC) chip and on a same horizontal level as the second integrated-circuit (IC) chip, wherein the connector comprises a substrate over the first integrated-circuit (IC) chip and a plu...