US Patent Issued to iCometrue on April 15 for "Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuits" (Taiwanese Inventors)

ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,192, issued on April 15, was assigned to iCometrue Co. Ltd. (Hsinchu County, Taiwan).

"Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuits" was invented by Mou-Shiung Lin (Hsinchu, Taiwan) and Jin-Yuan Lee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multichip package includes: a chip package comprising a first IC chip, a polymer layer in a space beyond and extending from a sidewall of the first IC chip, a through package via in the polymer layer, an interconnection scheme under the first IC chip, polymer layer and through package via, and a metal bump under th...