ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,231, issued on Sept. 9, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Printed wiring board" was invented by Susumu Kagohashi (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the insulating layer, and a via conductor formed in an opening formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The second conductor layer and via conductor include a seed layer and an electrolytic plating layer formed on the seed layer ...