ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,159, issued on Nov. 25, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Wiring substrate and method for manufacturing the same" was invented by Susumu Kagohashi (Ogaki, Japan) and Jun Sakai (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes an insulating layer including inorganic particles and resin, a seed layer formed on a surface of the insulating layer, and a conductor layer including a conductor pattern and formed on the seed layer. The surface of the insulating layer is a roughened surface formed such that the roughened surface of the insulating layer has exposed portions of the inorganic particles and re...