US Patent Issued to IBIDEN on Nov. 18 for "Wiring substrate" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,195, issued on Nov. 18, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate" was invented by Ikuya Terauchi (Ogaki, Japan), Shogo Fukui (Ogaki, Japan), Ryo Ando (Ogaki, Japan) and Keisuke Shimizu (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes first conductor pads formed on a surface of an insulating layer, second conductor pads formed on the surface of the insulating layer, a second insulating layer covering the surface of the insulating layer and first and second conductor pads, first via conductors formed in first via holes penetrating through the second insulating layer such that the first v...