ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,662, issued on Nov. 18, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Printed wiring board" was invented by Kentaro Wada (Ogaki, Japan) and Koji Kondo (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes an insulating layer, a first conductor layer formed on the insulating layer, an adhesive layer formed on the first conductor layer, a resin insulating layer formed on the insulating layer such that the adhesive layer is formed between the first conductor layer and the resin insulating layer, and a second conductor layer formed on the resin insulating layer. The first conductor layer is formed such that the ...