ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,663, issued on Nov. 18, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Printed wiring board" was invented by Susumu Kagohashi (Ogaki, Japan), Jun Sakai (Ogaki, Japan), Kyohei Yoshikawa (Ogaki, Japan) and Takuya Inishi (Ibi-gun, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board includes a first conductor layer, a resin insulating layer having an opening, a second conductor layer including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor including the seed layer and the electrolytic plating layer and connecting the first conductor and second conductor layers. The seed layer has a ...