US Patent Issued to IBIDEN on May 27 for "Method for manufacturing printed wiring board and printed wiring board" (Japanese Inventor)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,317,425, issued on May 27, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Method for manufacturing printed wiring board and printed wiring board" was invented by Atsushi Ishida (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a printed wiring board includes forming a first conductor layer, forming an adhesive layer including a nitrogen-based organic compound and covering a surface of the first layer, forming a resin insulating layer covering the adhesive layer and having the second surface facing the first conductor layer, forming a protective film on the first surface of the insulating layer, forming an opening ...