ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,920, issued on May 20, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Wiring substrate" was invented by Shogo Fukui (Ogaki, Japan), Kosuke Ikeda (Ogaki, Japan), Kosei Ichikawa (Ogaki, Japan) and Ryo Ando (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes an insulating layer including inorganic filler particles and resin, and a conductor layer including a metal film formed on a surface of the insulating layer and having a conductor pattern. The inorganic filler particles include first inorganic filler particles such that each of the first inorganic filler particles has a portion exposed on the surface of the in...