ALEXANDRIA, Va., June 12 -- United States Patent no. 12,302,493, issued on May 13, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).
"Wiring substrate" was invented by Toshiki Furutani (Ogaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a first insulating layer, a conductor layer including first and second conductor pads, a second insulating layer having an opening exposing the second conductor pads, and a wiring structure including a resin insulating layer and a wiring layer and formed in the opening of the second insulating layer. The wiring structure has first surface side connection pads, second surface side connection pads and electrically connected to the second condu...