US Patent Issued to IBIDEN on June 17 for "Wiring substrate and method for manufacturing wiring substrate" (Japanese Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,336,095, issued on June 17, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan).

"Wiring substrate and method for manufacturing wiring substrate" was invented by Toshiki Furutani (Ogaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring substrate includes a first conductor layer including wirings, an interlayer insulating layer formed on and covering the first conductor layer, a wiring layer formed in the interlayer insulating layer and including wirings, a second conductor layer formed on the interlayer insulating layer and including wirings, and a via conductor formed in the interlayer insulating layer such that the via conductor is penetrating...